Total: 31
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(16M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
104 MHz
24-TBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad