Total: 15
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
86 MHz
120 MHz
133 MHz
104 MHz
24-TBGA,CSPBGA