Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
2Mb(256K x 8)
8Mb(1M x 8)
2.3V ~ 3.6V
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
80 MHz
104 MHz
800µs
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)