Total: 60
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet,pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
16Mb(1M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Mb(256M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
0°C ~ 85°C(TA)
100 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
46-TFBGA
48-VFBGA
56-VFBGA
80-VFBGA
24-VBGA
64-FBGA(13x11)