Total: 10
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet,pallet
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
108 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad