Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)