Total: 28
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
32Mb(8M x 4)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - two I/O
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C
86 MHz
108 MHz
133 MHz
33 MHz
80 MHz
104 MHz
8-SOIC(0.154 ,3.90mm wide)
8-XFBGA,WLCSP
23-UFBGA,WLCSP
8-UDFN Exposed Pad
8-UFDFN Exposed Pad