Total: 10
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
128Mb(16M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
133 MHz
8ms,2.8ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
15-XFBGA,WLCSP
16-SOIC(0.295,7.50mm wide)