Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
CT
1Mb(128K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
75 MHz
15ms,5ms
15ms,3ms
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)