Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pipe
256Mb(32M x 8)
512Mb(64M x 8)
128Mb(16M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
108 MHz
66 MHz
80 MHz
8-SOIC(0.209,5.30mm wide)
16-SOIC(0.295,7.50mm wide)