Total: 373
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pipe
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
64Mb(8M x 8)
4Mb(512k x 8)
256Kb(32K x 8)
1.7V ~ 1.95V
2.5V ~ 3.6V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
166 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
60ns
8ms,2.8ms
3ms
16-SOIC(0.295 ,7.50mm wide)
5ms
30µs,800µs
60µs,5ms
24-TBGA
63-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-LCC(J feedthrough)
56-TFSOP(0.724,18.40mm wide)
8-TSSOP(0.173,4.40mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad
8-XDFN Exposed Pad
8-WFDFN Exposed Pad
8-SOIC