Total: 15
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pipe
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
166 MHz
8ms,2.8ms
16-SOIC(0.295 ,7.50mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)