Total: 26
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
128Mb(16M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
100 MHz
166 MHz
108 MHz
133 MHz
66 MHz
80 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
24-VBGA