Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
128Mb(16M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad