Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 105°C(TA)
108 MHz
80 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)