Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet,pallet
256Mb(32M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 105°C(TA)
133 MHz
80 MHz
16-SOIC(0.295,7.50mm wide)
8-WLGA