Total: 10
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
32Mb(4M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
104 MHz
12-UFBGA,WLCSP
60µs,5ms
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-XDFN Exposed Pad