Total: 20
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
128Mb(16M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
108 MHz
8ms,5ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)