Total: 87
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
64Mb(8M x 8,4M x 16)
2.7V ~ 3.6V
1.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
48-TFSOP(0.724,18.40mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
48-VFBGA
48-TSOP
64-FBGA(9x9)
48-FBGA(8.15x6.15)
64-FBGA(13x11)
56-TSOP