Total: 10
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
512Mb(64M x 8)
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
166 MHz
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)