Total: 15
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
1Mb(128k x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
80 MHz
104 MHz
3ms
800µs
30µs,800µs
8-UFDFN Exposed Pad