Total: 34
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
32Mb(4M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
133 MHz
104 MHz
3ms
12-UFBGA,WLCSP
12-XFBGA,WLCSP
60µs,5ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-DIP(0.300,7.62mm)
8-XDFN Exposed Pad