Total: 52
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
4Gb(256M x 16)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
32Mb(8M x 4)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
SPI - two I/O
1.65V ~ 2V
2.35V ~ 3.6V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
86 MHz
200 MHz
166 MHz
75 MHz
108 MHz
133 MHz
33 MHz
80 MHz
104 MHz
110ns
32-TFSOP(0.724 ,18.40mm wide)
56-TFSOP(0.724 ,18.40mm wide)
8-XFBGA,WLCSP
8-UFBGA,WLCSP
12-UFBGA,WLCSP
12-XFBGA,WLCSP
14-XFBGA,WLCSP
22-UFBGA,WLCSP
16-UFBGA,WLCSP
48-XFBGA,WLCSP
31-UFBGA,WLCSP
68-XFBGA,WLCSP
8-TSSOP(0.173 ,4.40mm wide)
63-VFBGA
8-WDFN Exposed Pad
8-UDFN Exposed Pad
8-UFDFN Exposed Pad