Total: 31
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
-40°C ~ 85°C(TA)
75 MHz
108 MHz
133 MHz
80 MHz
104 MHz
15ms,5ms
3ms
12-UFBGA,WLCSP
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-DIP(0.300,7.62mm)
8-XDFN Exposed Pad
8-WFDFN Exposed Pad