Total: 40
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
128Mb(16M x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
2.7V ~ 3.6V
1.7V ~ 2V
1.7V ~ 3.6V
-40°C ~ 105°C(TA)
133 MHz
60ns
8ms,2.8ms
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA