Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
1Mb(128K x 8)
4Mb(512K x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
40 MHz
5ms
8-SOIC(0.154,3.90mm wide)