Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
32Mb(8M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
108 MHz
8ms,5ms
8-SOIC(0.154,3.90mm wide)