Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT,
16Mb(2M x 8)
32Mb(4M x 8)
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
133 MHz
104 MHz
3ms
60µs,5ms
8-WDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad