Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,TR
256Mb(64M x 4)
512Mb(32M x 16)
4Mb(512K x 8,256K x 16)
64Mb(4M x 16)
128Mb(16M x 8,8M x 16)
32Mb(8M x 4)
64Mb(8M x 8,4M x 16)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 85°C(TC)
52 MHz
108 MHz
24-TBGA
48-TFSOP(0.724,18.40mm wide)
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA