Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,TR
256Mb(64M x 4)
32Mb(4M x 8)
32Mb(8M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
24-TBGA
16-SOIC(0.295,7.50mm wide)