Total: 20
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(32M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
3V ~ 3.6V
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 85°C(TA)
133 MHz
80 MHz
104 MHz
120 MHz
8ms,2.8ms
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
23-XFBGA,WLBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA