Total: 40
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
86 MHz
120 MHz
166 MHz
108 MHz
133 MHz
80 MHz
104 MHz
90ns
110ns
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad
56-TFBGA,CSPBGA