Total: 18
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
256Mb(32M x 8)
1.7V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
133 MHz
5ms
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-UFBGA,WLCSP