Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(64M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
8ms,5ms
24-TBGA
8-VDFN Exposed Pad