Total: 22
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
512Mb(64M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
1.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
100 MHz
166 MHz
133 MHz
66 MHz
80 MHz
24-TBGA
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
24-VBGA