Total: 13
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
512Mb(64M x 8)
SPI - Four I/O
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
200 MHz
166 MHz
108 MHz
16-SOIC(0.295 ,7.50mm wide)
68-XFBGA,WLCSP
24-TBGA
8-WDFN Exposed Pad