Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Gb(128M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
166 MHz
133 MHz
104 MHz
8ms,2.8ms
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
64-LBGA