Total: 30
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
1Gb(128M x 8)
1.7V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
ONFI
-40°C ~ 85°C(TA)
166 MHz
133 MHz
104 MHz
22 ns
25ns
3ms
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)