Total: 21
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
CT
pipe
1Mb(128K x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - two I/O
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
75 MHz
3ms
15ms,3ms
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad