Total: 36
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
2Mb(256K x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
2.35V ~ 3.6V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
86 MHz
75 MHz
108 MHz
33 MHz
80 MHz
104 MHz
70ns
90ns
8-SOIC(0.154 ,3.90mm wide)
48-TFSOP(0.724 ,18.40mm wide)
8-UFBGA,WLCSP
44-SOIC(0.496 ,12.60mm wide)
8-TSSOP(0.173 ,4.40mm wide)
8-WDFN Exposed Pad
8-UDFN Exposed Pad
8-UFDFN Exposed Pad