Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
2Mb(256K x 8)
2.3V ~ 3.6V
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
104 MHz
800µs
8-UFDFN Exposed Pad