Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
2Mb(256K x 8,128K x 16)
4.5V ~ 5.5V
-40°C ~ 85°C(TA)
70ns
55ns
48-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)