Total: 46
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
pipe
4Mb(512K x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
100 MHz
40 MHz
75 MHz
80 MHz
104 MHz
15ms,5ms
3ms
800µs
5ms
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
32-LCC(J feedthrough)
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)