Total: 40
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
4Mb(512K x 8)
2.7V ~ 3.6V
4.5V ~ 5.5V
SPI - Four I/O
1.65V ~ 2V
2.35V ~ 3.6V
-40°C ~ 85°C(TA)
86 MHz
40 MHz
75 MHz
80 MHz
70ns
90ns
55ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
8-WDFN Exposed Pad
32-LCC(J feedthrough)