Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
pipe
4Mb(512K x 8)
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
8-UFBGA,WLCSP
8-UFDFN Exposed Pad