Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
4Mb(512K x 8)
2.3V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
104 MHz
800µs
8-UFDFN Exposed Pad