Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
8Mb(1M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
80 MHz
104 MHz
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad