Total: 16
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
8Mb(1M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
70ns
48-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)