Total: 23
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
16Mb(2M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
86 MHz
80 MHz
104 MHz
70ns
90ns
48-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad