Total: 31
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
32Mb(4M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
4.5V ~ 5.5V
SPI - Four I/O,QPI
1.65V ~ 2V
2.1V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
75 MHz
108 MHz
133 MHz
104 MHz
120 MHz
70ns
15ms,5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
40-TFSOP(0.724,18.40mm wide)
8-UDFN Exposed Pad
10-XFBGA,WLCSP